| Government R&D Projects | |
|---|---|
| 1 | Production of high-purity rare earth metals |
| 2 | Localization (domestic production) of key materials and technologies |
| 3 | Manufacturing of large-area, high-melting-point alloy targets |
| 4 | Development of a high-durability combustion decomposition module for treating perfluorinated compounds (PFCs) in exhaust gases to address safety issues caused by gas emissions during semiconductor processes |
| 5 | Development of fine yttrium oxide powder materials for aerosol deposition capable of producing plasma-resistant, high-density thick films |
| 6 | Reduction and refining technology for high-purity Nd metal for high-performance permanent magnets |
| 7 | Development of eco-friendly solid oxide membrane (SOM) smelting technology for rare metal production to reduce manufacturing costs |
| 8 | Development of new in-plasma coating materials and coating process technologies for components used in high-power F- and Cl-based plasma processes (semiconductor electrostatic chucks) |
| 9 | Development of a new fluoride-based in-plasma hybrid coating process with porosity ≤1% and hardness ≥500 Hv to achieve uniform etch rates in 300 mm large-area semiconductor equipment |
| 10 | Development of ultra-high-density YAG in-plasma PVD coating technology for components used in compact semiconductor dry etching equipment |
| 11 | Development of yttrium oxide materials and coating technologies for suspension plasma spraying |
| 12 | Development of a vacuum suspension plasma spraying system equipped with neural networks to optimize process parameters for maximum deposition rate, and development of dielectric layer manufacturing processes to replace Japanese ceramic-sheet electrostatic chucks |
| 13 | Localization of plasma spraying technology capable of forming ultra-high-density ceramic coating layers with thicknesses of 100 μm or more and density above 99% |
| 14 | Development of a high-temperature lower chuck technology capable of heating up to 250°C for 8.x-generation display etching processes |
| 15 | Development of hybrid high-density plasma source technology combining non-scanning antennas and remote methods for 8.6-generation display dry etching |
| 16 | Development of high-purity Ni–Cr–Mo materials and core component technologies for the semiconductor and energy industries |
| 17 | Development of ~40 μm-thick metal substrates based on high-purity Ni–Cr–Mo materials and componentization technology for superconducting materials |
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