Advanced Materials
Enhancing Performance at the Core
Materials & Components
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We manufacture a wide range of materials and components, including ceramic powders, ceramics, metals, and superconducting targets.
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Powder
In 2013, we became the first company in Korea to successfully localize APS coating materials for semiconductor applications. Since then, we have been producing a wide range of coating powders, including Y₂O₃ and YAG, enabling a more stable and reliable supply of coating materials to the domestic market.
EAPS = High-Hardness Y₂O₃ Enhanced APS
It exhibits stable spraying characteristics even in high-temperature plasma environments and enables the formation of dense and uniform coating layers. It is well suited for coating components that require wear resistance, heat resistance, and corrosion resistance, and is widely applied across various industrial applications. YttriaIt is a high-purity ceramic material with excellent plasma resistance and chemical stability, making it suitable for preventing corrosion of semiconductor process components. With a high melting point and superior insulating properties, it maintains stable performance even in high-temperature and high-voltage environments. Yttrium Aluminum GarnetIt is a composite ceramic material of Y₂O₃ and Al₂O₃, offering both excellent plasma resistance and thermal stability as a high-performance coating material. With high hardness and superior insulating properties, it is effective in preventing wear and corrosion of semiconductor process components. Its chemical composition remains highly stable even in high-temperature environments, providing long-term reliable protection. Yttrium OxyFluorideIt is a next-generation ceramic material that offers both excellent plasma resistance and chemical stability. Even in fluorine-based plasma environments, corrosion is minimal, making it well suited for protective coatings on components used in semiconductor etching processes. Compared to Y₂O₃, it features reduced particle detachment and lower particle generation.
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SPS / AD
We possess milling technologies for producing coating materials used in SPS and AD processes with particle sizes below 10 µm, along with dispersion technologies for preparing these materials in slurry form after milling.
Through government-funded national R&D projects, we have developed technologies that enable precise control of particle sizes ranging from 0.1 µm to 10 µm, tailored to specific applications, using milling and synthesis methods.
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Targets for Semiconductor Applications
The OTS target is one of the most advanced materials for PCM memory, based on chalcogenide materials*. It is a high-end target that integrates advanced technologies to form a uniform glass phase over a large area.
The OTS target is a chalcogenide-based sputtering target used to form Ovonic Threshold Switch (OTS) thin films, which serve as selector devices in non-volatile memory.
GST target
GeTe–Sb₂Te₃ (Ge₂Sb₂Te₅ is a representative composition) / Germanium–Antimony–Telluride
By applying short electrical pulses to control temperature, phase changes can be induced, making this material suitable for use in PCM device fabrication.
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Targets for Superconducting Applications
YBa₂Cu₃O₇₋ₓ (YBa₂Cu₃O₇ is a representative composition)
Yttrium-Barium-Copper Oxide
Used to fabricate thin films with excellent superconducting properties.
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Target Manufacturing Technology
Proprietary technology for manufacturing sputtering targets
Hot press / Spray coating processes
Metal / ceramic materials
Raw powder preparation
- Metal: Gas atomization
- Ceramic: Spray drying
*Multi-component composition control